Solder paste column M705, flux, board washing h2o with complete Liquor; board washing drinking water is used to scrub up the solder residue immediately after repair; thermal gel (specification: Fujipoly SPG-30B) is used to smear the floor of your chip soon after repair ；ball-planting metal mesh, solder absorption wire, https://johnf060oet3.wikiconversation.com/user